At the heart of 6G-RIC are six Technical Innovation Areas (TIAs), which serve as technology drivers for 6G. Each TIA is associated with specific research challenges, whose resolution lies at the focus of the 6G-RIC research agenda. In this document, we formulate these challenges in the form of key research questions that should be answered within each of the six TIAs. Due to the interdisciplinary nature of the selected questions, 6G-RIC undertakes a holistic approach that simultaneously investigates hardware architectures, signal and protocol design, network computing aspects, as well as algorithmic and implementation complexity. In this context, energy efficiency and security play a leading role as horizontal aspects overarching all studied technologies.
D-Band Sensing
Neuromorphic Wireless Cognition for Connected Intelligence
Open-source End-to-End Testbed for 6G Research
At the heart of 6G-RIC are six Technical Innovation Areas (TIAs), which serve as technology drivers for 6G. Each TIA is associated with specific research challenges, whose resolution lies at the focus of the 6G-RIC research agenda. In this document, we formulate these challenges in the form of key research questions that should be answered within each of the six TIAs. Due to the interdisciplinary nature of the selected questions, 6G-RIC undertakes a holistic approach that simultaneously investigates hardware architectures, signal and protocol design, network computing aspects, as well as algorithmic and implementation complexity. In this context, energy efficiency and security play a leading role as horizontal aspects overarching all studied technologies.
D-Band Sensing
Neuromorphic Wireless Cognition for Connected Intelligence
Open-source End-to-End Testbed for 6G Research
Fraunhofer Heinrich-Hertz-Institut, HHI
Prof. Dr.-Ing. Slawomir Stanczak
Einsteinufer 37
D–10587 Berlin
E-Mail: info@6g-ric.de
Fraunhofer Heinrich-Hertz-Institut, HHI
Prof. Dr.-Ing. Slawomir Stanczak
Einsteinufer 37
D–10587 Berlin
E-Mail: info@6g-ric.de