We are happy about a successful European Microwave Week in Berlin from 17 – 22 September 2023. The 6G-RIC team works to lay the scientific and technical foundations across all technology levels, from radio access to core networks and fiber optic transport networks. At the 6G-RIC booth, we exhibited the following:
DEMOS
CHIPS
BOARDS / COMPONENTS / SETUPS
Kudos to our amazing team: Michael Peter, Slawomir Stanczak, Ramez Askar, Mathis Schmieder, Sven Wittig, Alper Schultze, Niclas Kullig, Elena Kempf-Loeck, Jelena, Murašova, Karthik Krishnegowda, Christoph Herold and Markus Fritscher about the project’s state-of-the-art research & technology. Thanks to our project partners IHP, Technische Universität Berlin, Ferdinand-Braun-Institute, Fraunhofer IAF and Technische Universität Braunschweig! 6G-RIC is funded by the Bundesministerium für Bildung und Forschung.
Follow us on our journey towards sustainable and secure 6G technologies, and meet us again during IEEE @GLOBECOM 2023.
Fraunhofer Heinrich-Hertz-Institut, HHI
Prof. Dr.-Ing. Slawomir Stanczak
Einsteinufer 37
D–10587 Berlin
E-Mail: info@6g-ric.de
Fraunhofer Heinrich-Hertz-Institut, HHI
Prof. Dr.-Ing. Slawomir Stanczak
Einsteinufer 37
D–10587 Berlin
E-Mail: info@6g-ric.de